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[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler
Kino, Hisashi, Fukushima, Takafumi, Tanaka, TetsuYear:
2016
Language:
english
DOI:
10.1109/3DIC.2016.7970031
File:
PDF, 980 KB
english, 2016