Design, Fabrication, and Characterization of Dense...

IEEE Transactions on Components Packaging and Manufacturing Technology 2017 / 7 Vol. 7; Iss. 7

Design, Fabrication, and Characterization of Dense Compressible Microinterconnects

Jo, Paul K., Zia, Muneeb, Gonzalez, Joe L., Oh, Hanju, Bakir, Muhannad S.
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2688281
Date:
July, 2017
File:
PDF, 3.66 MB
english, 2017
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