Wafer-level Vacuum Packaged X and Y axis Gyroscope Using...

IFAC Proceedings Volumes 2008 Vol. 41; Iss. 2

Wafer-level Vacuum Packaged X and Y axis Gyroscope Using the Extended SBM Process for Ubiquitous Robot applications

Choi, Byoung-Doo, Paik, Seung-Joon, Lee, Sangmin, Ko, Hyoungho, Yoo, Kwangho, Kim, Nam-Kuk, Cho, Dong-il “Dan”
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Volume:
41
Year:
2008
Language:
english
Journal:
IFAC Proceedings Volumes
DOI:
10.3182/20080706-5-kr-1001.00744
File:
PDF, 1.39 MB
english, 2008
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