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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination
Yamamoto, Michitaka, Higurashi, Eiji, Suga, Tadatomo, Sawada, Renshi, Itoh, ToshihiroYear:
2017
Language:
english
DOI:
10.23919/LTB-3D.2017.7947460
File:
PDF, 153 KB
english, 2017