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Applied Thermal Engineering 2017 / 7

Optimization of the thermal distribution of multi-chip LED package

Ben Abdelmlek, K., Araoud, Z., Charrada, K., Zissis, G.
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Language:
english
Journal:
Applied Thermal Engineering
DOI:
10.1016/j.applthermaleng.2017.07.136
Date:
July, 2017
File:
PDF, 1.06 MB
english, 2017
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