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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Hydrogen radical treatment for surface oxide removal from copper
Shin, S., Higurashi, E., Furuyama, K., Suga, T.Year:
2017
Language:
english
DOI:
10.23919/LTB-3D.2017.7947468
File:
PDF, 173 KB
english, 2017