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Hydrogen thermal reductive Cu nanowires in low temperature Cu–Cu bonding
Du, Li, Shi, Tielin, Su, Lei, Tang, Zirong, Liao, GuanglanVolume:
27
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/aa74fb
Date:
July, 2017
File:
PDF, 3.71 MB
english, 2017