![](/img/cover-not-exists.png)
[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - N5 technology node dual-damascene interconnects enabled using multi patterning
Briggs, B., Wilson, C. J., Devriendt, K., van der Veen, M. H., Decoster, S., Paolillo, S., Versluijs, J., Kesters, E., Sebaai, F., Jourdan, N., El-Mekki, Z., Heylen, N., Verdonck, P., Wan, Danny, PedrYear:
2017
Language:
english
DOI:
10.1109/IITC-AMC.2017.7968983
File:
PDF, 587 KB
english, 2017