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Sensors and Actuators A: Physical 2017 / 7

Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology

Zhao, Libo, Li, Jie, Li, Zhikang, Zhang, Jiawang, Zhao, Yihe, Wang, Jiuhong, Xia, Yong, Li, Ping, Zhao, Yulong, Jiang, Zhuangde
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Language:
english
Journal:
Sensors and Actuators A: Physical
DOI:
10.1016/j.sna.2017.07.044
Date:
July, 2017
File:
PDF, 338 KB
english, 2017
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