[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - The influence of device morphology on wafer-level bonding with polymer-coated layer
Liang, Hao-Wen, Chen, Hsiu-Chi, Lin, Chien-Hung, Lee, Chia-Lin, Yang, Shan-Chun, Chen, Kuan-NengYear:
2016
Language:
english
DOI:
10.1109/3DIC.2016.7970009
File:
PDF, 2.66 MB
english, 2016