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[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Fabrication challenge, device characterization of high-Q 2D, 3D passives devices on glass
Hsieh, Sheng-Chi, Chen, Chien-Hua, Chang, Yung-Shun, Lee, Teck Chong, Lee, Pao-Nan, Wang, Chen-Chao, Chou, Yuan-HsiYear:
2016
Language:
english
DOI:
10.1109/EDAPS.2016.7893130
File:
PDF, 728 KB
english, 2016