Analysis of the Effect of TSV-induced Stress on Devices...

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IEEE Transactions on Device and Materials Reliability 2017

Analysis of the Effect of TSV-induced Stress on Devices Performance by Direct Strain and Electrical Measurements and FEA Simulations

Kteyan, Armen, Muehle, Uwe, Gall, Martin, Sukharev, Valeriy, Radojcic, Riko, Zschech, Ehrenfried
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Year:
2017
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2017.2732826
File:
PDF, 2.31 MB
english, 2017
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