![](/img/cover-not-exists.png)
Modeling of the interface formation during CuO deposition on Al(111) substrate: linking material design and elaboration process parameters through multi-levels approach
Guiltat, M, Salles, N, Brut, M, Landa, G, Richard, N, Vizzini, S, Hémeryck, AVolume:
25
Language:
english
Journal:
Modelling and Simulation in Materials Science and Engineering
DOI:
10.1088/1361-651X/aa7bbc
Date:
September, 2017
File:
PDF, 2.62 MB
english, 2017