Multi-Physics Simulation of a Microprocessor Package Under...

Journal of Electronic Packaging 2004 Vol. 126; Iss. 3

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

Bao-Min, Liu, Y. C., Mui
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1774197
File:
PDF, 238 KB
english, 2004
Conversion to is in progress
Conversion to is failed