Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
Snigdha Tummala, Vana, Mian, Ahsan, Chamok, Nowrin H., Poduval, Dhruva, Ali, Mohammod, Clifford, Jallisa, Majumdar, PrasunVolume:
139
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4036384
Date:
June, 2017
File:
PDF, 6.37 MB
english, 2017