Stress and Deflection Development During Die Embedding into Printed Circuit Boards
Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M., Lecavelier, A.Volume:
2
Year:
2015
Language:
english
Journal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2015.09.003
File:
PDF, 1.47 MB
english, 2015