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Microelectronics Reliability 2017 / 7

High temperature ageing of microelectronics assemblies with SAC solder joints

Sabbah, Wissam, Bondue, Pierre, Avino-Salvado, Oriol, Buttay, Cyril, Frémont, Hélène, Guédon-Gracia, Alexandrine, Morel, Hervé
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.06.065
Date:
July, 2017
File:
PDF, 1.49 MB
english, 2017
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