Thermal stress probing the channel-length modulation effect...

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Microelectronics Reliability 2017 / 7

Thermal stress probing the channel-length modulation effect of nano n-type FinFETs

Tuan, Fu-Yuan, Chen, Chii-Wen, Wang, Mu-Chun, Liao, Wen-Shiang, Wang, Shea-Jue, Fan, Shou-Kong, Lan, Wen-How
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.06.067
Date:
July, 2017
File:
PDF, 3.60 MB
english, 2017
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