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Microelectronics Reliability 2017 / 7

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Ključar, Luka, González, Mario, Croes, Kristof, De Wolf, Ingrid, De Messemaeker, Joke, Murdoch, Gayle, Nolmans, Philip, De Vos, Joeri, Bömmels, Jürgen, Beyne, Eric, Tőkei, Zsolt
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.07.017
Date:
July, 2017
File:
PDF, 3.81 MB
english, 2017
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