[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Reliability Challenges in 2.5D and 3D IC Integration
Li, Li, Ton, Paul, Nagar, Mohan, Chia, PierreYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.208
File:
PDF, 1.56 MB
english, 2017