[IEEE 2017 IEEE 67th Electronic Components and Technology...

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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - 3D Packaging of Embedded Opto-Electronic Die and CMOS IC Based on Wet Etched Silicon Interposer

Li, Chenhui, Smalbrugge, Barry, Li, Teng, Stabile, Ripalta, Raz, Oded
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Year:
2017
Language:
english
DOI:
10.1109/ECTC.2017.222
File:
PDF, 1.04 MB
english, 2017
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