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[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements
Beyne, S., Croes, K., van der Veen, M. H., Pedreira, O. Varela, Qi, Q., Wolf, I. De, Tokei, Zs.Year:
2017
Language:
english
DOI:
10.1109/IITC-AMC.2017.7968946
File:
PDF, 313 KB
english, 2017