[IEEE 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) - Sapporo, Japan (2017.5.28-2017.6.1)] 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) - Stacked resin structure for reducing warpage of transfer-molded modules
Iwahashi, Seita, Otsuka, Takukazu, Nakamura, TakashiYear:
2017
DOI:
10.23919/ISPSD.2017.7988974
File:
PDF, 503 KB
2017