[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects
Choi, Sumin, Kim, Heegon, Kim, Kiyeong, Park, Junyong, Jung, Daniel H., Kim, JounghoYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.160
File:
PDF, 1.06 MB
english, 2017