[IEEE 2017 IEEE 67th Electronic Components and Technology...

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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects

Choi, Sumin, Kim, Heegon, Kim, Kiyeong, Park, Junyong, Jung, Daniel H., Kim, Joungho
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Year:
2017
Language:
english
DOI:
10.1109/ECTC.2017.160
File:
PDF, 1.06 MB
english, 2017
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