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[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - Pure Co films of low resistivity and high conformality by low temperature thermal CVD/ALD using novel Co precursors
Rochat, Raphael, Oschchepkov, Ivan, Ko, ChangheeYear:
2017
Language:
english
DOI:
10.1109/iitc-amc.2017.7968940
File:
PDF, 302 KB
english, 2017