[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Warpage Study of Large 2.5D IC Chip Module
Lai, Chieh-Lung, Li, Hung-Yuan, Peng, Sam, Lu, Terren, Chen, StephenYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.210
File:
PDF, 1.44 MB
english, 2017