Impact Resistance of SM Joints Formed With ICA

Wu, C. M. Lawrence, Li, Robert K. Y., Yeung, N. H.

How much do you like this book?

What’s the quality of the file?

Download the book for quality assessment

What’s the quality of the downloaded files?

Volume:

125

Year:

2003

Language:

english

Journal:

Journal of Electronic Packaging

DOI:

10.1115/1.1534842

File:

PDF, 945 KB

english, 2003

Conversion to is in progress

Conversion to is failed