[ASME ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2 - Numerical Solution Methodology for Compact Thermal Models of Electronic Packages
Gupta, Rohit Dev, Eswaran, VinayakYear:
2007
Language:
english
DOI:
10.1115/HT2007-32139
File:
PDF, 670 KB
english, 2007