[IEEE 2017 IEEE 67th Electronic Components and Technology...

  • Main
  • [IEEE 2017 IEEE 67th Electronic...

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Comparison of Packaging Concepts for High-Temperature Pressure Sensors at 500 °C

Subbiah, Nilavazhagan, Ghosh, Surajit, Wilde, Juergen, Zeiser, Roderich
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
Language:
english
DOI:
10.1109/ECTC.2017.255
File:
PDF, 422 KB
english, 2017
Conversion to is in progress
Conversion to is failed