[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology
Miao, Min, Li, Zhensong, Duan, Xiaoyang, Chen, Tianfang, Liu, Huan, Sun, Xin, Cui, Xiaole, Jin, YufengYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.85
File:
PDF, 1.09 MB
english, 2017