Thermal Analysis of High-Power Flip-Chip-Bonded Photodiodes

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Journal of Lightwave Technology 2017

Thermal Analysis of High-Power Flip-Chip-Bonded Photodiodes

Shen, Yang, Gaskins, John, Xie, Xiaojun, Foley, Brian McCormack, Cheaito, Ramez, Hopkins, Patrick E., Campbell, Joe C.
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Year:
2017
Language:
english
Journal:
Journal of Lightwave Technology
DOI:
10.1109/JLT.2017.2736884
File:
PDF, 1004 KB
english, 2017
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