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[IEEE 2016 IEEE Hot Chips 28 Symposium (HCS) - Cupertino, CA, USA (2016.8.21-2016.8.23)] 2016 IEEE Hot Chips 28 Symposium (HCS) - A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package
Mu-Shan Lin,, Chien-Chun Tsai,, Cheng-Hsiang Hsieh,, Wen-Hung Huang,, Yu-Chi Chen,, Shu-Chun Yang,, Chin-Ming Fu,, Hao-Jie Zhan,, Jinn-Yeh Chien,, Shao-Yu Li,, Chen, Y.-H., Kuo, C.-C., Shih-Year:
2016
Language:
english
DOI:
10.1109/hotchips.2016.7936211
File:
PDF, 2.18 MB
english, 2016