SPIE Proceedings [SPIE SPIE Microtechnologies - Barcelona, Spain (Monday 8 May 2017)] Smart Sensors, Actuators, and MEMS VIII - Innovative metal thermo-compression wafer bonding for microelectronics and MEMS devices
Fonseca, Luis, Prunnila, Mika, Peiner, Erwin, Rebhan, B., Dragoi, V.Volume:
10246
Year:
2017
Language:
english
DOI:
10.1117/12.2266492
File:
PDF, 848 KB
english, 2017