[IEEE 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Bordeaux, France (2017.5.29-2017.6.1)] 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Design, fabrication and characterization of RF MEMS switches with robust contact

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