[IEEE 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Bordeaux, France (2017.5.29-2017.6.1)] 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - A low cost patternable packaging technology for biosensors
Buchoux, Anthony, Blair, Ewen O., Tsiamis, Andreas, Marland, Jamie R. K., Smith, StewartYear:
2017
Language:
english
DOI:
10.1109/dtip.2017.7984493
File:
PDF, 2.17 MB
english, 2017