[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Fine Pitch Interconnect Rework for Lead-Free Flip Chip Packages
Kanso, M., Danovitch, D., Nguena, E., Langlois, R., Bergeron, C.Year:
2017
Language:
english
DOI:
10.1109/ECTC.2017.89
File:
PDF, 1.42 MB
english, 2017