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[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Failure mechanisms of boards in a thin wafer level chip scale package
Rajmane, Pavan, Khan, Hassaan Ahmad, Doiphode, Aniruddha, Rahangdale, Unique, Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, LuuYear:
2017
DOI:
10.1109/ITHERM.2017.7992611
File:
PDF, 1.42 MB
2017