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Thermal Science and Engineering Progress 2017 / 8

Numerical Simulation of Heat Transfer for Microelectronic Heat Sinks with Different Fin Geometries in Tandem and Staggered Arrangements

Limbasiya, Nimesh, Roy, Arnab, Harichandan, Atal Bihari
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Language:
english
Journal:
Thermal Science and Engineering Progress
DOI:
10.1016/j.tsep.2017.08.002
Date:
August, 2017
File:
PDF, 1.44 MB
english, 2017
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