[IEEE 2017 IEEE 67th Electronic Components and Technology...

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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Development of Large Size CPU Package Structure Using Embedded Thin Film Capacitor Package Substrate

Fukuzono, Kenji, Watanabe, Manabu, Mizutani, Daisuke, Akahoshi, Tomoyuki, Fujisaki, Hidehiko, Yamawaki, Seigo, Fukui, Kei
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Year:
2017
Language:
english
DOI:
10.1109/ECTC.2017.128
File:
PDF, 1.99 MB
english, 2017
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