[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Embedded Trench Redistribution Layers (RDL) by Excimer Laser Ablation and Surface Planer Processes
Suzuki, Yuya, Sundaram, Venky, Tummala, Rao, Hichri, Habib, Seongkuk, Lee, Arendt, Markus, Chen, Ye, Lee, Kwon Sang, Wei, Frank, Dimov, Ognian, Arora, Deepak, Malik, SanjayYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.15
File:
PDF, 703 KB
english, 2017