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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Compression Molding Encapsulants for Wafer-Level Embedded Active Devices: Wafer Warpage Control by Epoxy Molding Compounds
Kwon, Kihyeok, Lee, Yoonman, Kim, Junghwa, Chung, Joo Young, Jung, Kyunghag, Park, Yong-Yeop, Lee, Donghwan, Kim, Sang KyunYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.266
File:
PDF, 355 KB
english, 2017