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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Physical and Electrical Characterization of 3D Embedded Capacitor: A High-Density MIM Capacitor Embedded in TSV
Lin, Ye, Tan, Chuan SengYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.45
File:
PDF, 915 KB
english, 2017