Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn...

Journal of Electronic Packaging 2004 Vol. 126; Iss. 2

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

Xin, X. J., Pei, Z. J., Liu, Wenjie
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Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1649243
File:
PDF, 880 KB
english, 2004
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