Effect of Deposition Temperature on Thermal Stabilities of Copper–Carbon Films in Barrier-less Cu Metallization
Zhu, Huan, Fu, Zhiqiang, Xie, Qi, Yue, Wen, Wang, Chengbiao, Kang, Jiajie, Zhu, LinaLanguage:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2017.08.017
Date:
August, 2017
File:
PDF, 627 KB
english, 2017