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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Packaging Innovations for High Voltage (HV) GaN Technology
Mishra, D., Arora, V., Nguyen, L., Iriguchi, S., Sada, H., Clemente, L., Lim, S., Lin, HY, Lohia, A., Gurrum, S., Sauser, J., Spencer, S.Year:
2017
Language:
english
DOI:
10.1109/ECTC.2017.322
File:
PDF, 325 KB
english, 2017