[IEEE 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) - Kaohsiung, Taiwan (2017.6.18-2017.6.22)] 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) - 250°C wafer-level vacuum sealing using electroplated copper bonding frame planarized by fly-cutting

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.