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Ag@Sn Core-Shell Powder Preform with a High Re-Melting Temperature for High-Temperature Power Devices Packaging
Yu, Fuwen, Wang, Bin, Guo, Qiang, Ma, Xin, Li, Mingyu, Chen, HongtaoLanguage:
english
Journal:
Advanced Engineering Materials
DOI:
10.1002/adem.201700524
Date:
August, 2017
File:
PDF, 1.92 MB
english, 2017