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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems
Choobineh, Leila, Agonafer, Dereje, Jain, AnkurYear:
2013
Language:
english
DOI:
10.1115/IPACK2013-73166
File:
PDF, 1.48 MB
english, 2013