![](/img/cover-not-exists.png)
[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)
Choobineh, Leila, Vo, Nick, Uehling, Trent, Jain, AnkurYear:
2013
Language:
english
DOI:
10.1115/ipack2013-73167
File:
PDF, 1.46 MB
english, 2013