![](/img/cover-not-exists.png)
Techniques to reduce thermal resistance in flip-chip GaN-based VCSELs (Phys. Status Solidi A 8∕2017)
Mishkat-Ul-Masabih, Saadat, Leonard, John, Cohen, Daniel, Nakamura, Shuji, Feezell, DanielVolume:
214
Journal:
physica status solidi (a)
DOI:
10.1002/pssa.201770149
Date:
August, 2017
File:
PDF, 938 KB
2017