Techniques to reduce thermal resistance in flip-chip...

physica status solidi (a) 2017 / 08 Vol. 214; Iss. 8

Techniques to reduce thermal resistance in flip-chip GaN-based VCSELs (Phys. Status Solidi A 8∕2017)

Mishkat-Ul-Masabih, Saadat, Leonard, John, Cohen, Daniel, Nakamura, Shuji, Feezell, Daniel
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
214
Journal:
physica status solidi (a)
DOI:
10.1002/pssa.201770149
Date:
August, 2017
File:
PDF, 938 KB
2017
Conversion to is in progress
Conversion to is failed